The EPA has recently issued a new regulation in order to modify current monitoring and calculation requirements regarding the Electronics Manufacturing section of the Greenhouse Gas (GHG) Reporting Rule for large semiconductor manufacturing facilities.
Such facilities are considered “large” if they “have an annual manufacturing capacity of greater than 10,500 square meters” and/or they “fabricate devices on wafers measuring 300 millimeters or less in diameter,” according to the EPA.
Larger facilities will now be able to calculate and report their emissions of GHG while utilizing non-payment emission factors that are already featured in the GHG Reporting Rule regulations. As of now, these facilities can report their emissions in this manner throughout the remainder of 2011, as well as 2012 and 2013.
The regulation will be effective as of Sept. 30, 2011.
For more information, please visit this link.
Such facilities are considered “large” if they “have an annual manufacturing capacity of greater than 10,500 square meters” and/or they “fabricate devices on wafers measuring 300 millimeters or less in diameter,” according to the EPA.
Larger facilities will now be able to calculate and report their emissions of GHG while utilizing non-payment emission factors that are already featured in the GHG Reporting Rule regulations. As of now, these facilities can report their emissions in this manner throughout the remainder of 2011, as well as 2012 and 2013.
The regulation will be effective as of Sept. 30, 2011.
For more information, please visit this link.


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